Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

THERMAL MECHANICAL TEST ENGINEER, SILICON PACKAGING (STARLINK)

SpaceX is leveraging our experience building rockets and spacecraft to deploy Starlink, the world’s largest satellite constellation and most advanced broadband internet system. We provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. We design, build, test, and operate all parts of the system, thousands of satellites and consumer dishes that allow users to connect within minutes of unboxing. The Starlink team is seeking out the best-in-class professionals to maximize Starlink’s potential for communities and businesses around the globe.

As a Thermal Mechanical Test Engineer for Silicon Packaging at SpaceX, you will develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board-level assemblies. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high-volume production of reliable Starlink hardware.

RESPONSIBILITIES:

• Develop and run thermal and mechanical finite element models, and thermal simulations, to predict package and board-level behavior under operational and environmental conditions

• Develop process models to support new

Department: Starlink Process Engineering