Primary record

Physical Design Engineer, PnR

Tenstorrent Indexed employerAustin, Texas, United States; Fort Collins, Colorado, United States; Santa Clara, California, United States · Austin, Texas, United States
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Workplace

hybrid

Employment

Other

Published

Aug 11, 2026

Closes

No date supplied

The role

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is seeking talented Physical Design Engineers to implement high-performance partitions for an industry-leading AI SOC. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team.

This role is hybrid, based out of Austin,TX or Santa Clara, CA or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are

• Experienced with synthesis and place-and-route flows, especially using Synopsys Design Compiler / Fusion Compiler and IC Compiler II.

• Comfortable in a small, cross-functional physical design team, owning a block or subsystem and partnering on tapeout milestones with clear communication and accountability.

• Ideally bring extra depth in areas such as UPF/multi-voltage power domains, SoC interface IP integration (e.g. I3C, UART), signoff breadth (DRC/LVS,

Requirements

Department: Advanced Physical Design