Workplace
On-site
Employment
Full-Time
Published
Jun 10, 2026
Closes
No date supplied
The role
Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. This architecture allows Cerebras to deliver industry-leading training and inference speeds; over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation. Cerebras works with the leading model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership https://openai.com/index/cerebras-partnership/ with Cerebras, to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference. About The Role As a member of our tight knit physical design team, you will be working on the design and analysis of 3D integrated products. This role involves a combination of traditional ASIC/SoC physical design skills, packaging, power, clock and cooling analysis. You will work closely with the architecture and RTL team to do R&D on novel concepts for 3D integration. Skills and Qualifications Required: - 10+ years of physical design/verification experience. - Strong knowledge of block level and full-chip physical verification methodology. - Strong background in block physical design, Synthesis, PDV and IR. - Expert at optimizing for the best power/performance and area. - Experience with the complete physical design flow. Knowledge of Synopsys tool suite is a plus. - Expert with ICV or Calibre tools resolving block and full-chip DRC and LVS issues. - Expert with IR/EM analysis and resolution. - Strong ability in scripting languages like Tcl and Python. Ability to make flow enhancements. - Demonstrated ability to work with RTL teams to optimize for physical design. - Should demonstrate ownership, deep dive and should demonstrate strong fundamental understanding of PD concepts. - Knowledge of 2.5D or 3D packaging solutions. Preferred:
Requirements
Department: Hardware Departments; Team: Silicon