Primary record

PCB Layout Engineer

Tenstorrent Indexed employerSanta Clara, California, United States; Toronto, Ontario, Canada · Santa Clara, California, United States
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Workplace

hybrid

Employment

Internship

Published

Aug 11, 2026

Closes

No date supplied

The role

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is seeking a Layout Engineer with expertise in board layout for high-performance computing and AI hardware. This role requires direct experience with multi-layer boards, HDI vias, blind vias, back drilling, DFM, DFA and routing / layout of interfaces like GDDR, LPDDR, DDR, PCIe Gen 5 & 6, Ethernet IEEE 802.3bj, cd, cf, USB, etc. The ideal candidate will work closely with cross-functional teams consisting of engineers from systems, power, signal integrity and mechanical to ensure that our products meet the layout margins and cutting-edge specifications for mass production boards for data centers, workstations, and consumer computing applications.

This role is hybrid, based out of Toronto, ON or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are

• Experienced board layout engineer with ~8+ years in PCB design (Cadence Allegro; Altium a plus).

• Hold a B.S. in EE, CS, or equivalent experience.

• Strong background in high-speed, complex PCBs (high layer count, HDI, multi-lamination, VIPPO, back

Requirements

Department: Systems Engineering