Packaging Architect

Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.

Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!

If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.

Lightmatter is (re)inventing the future of computing with light!

About This Role

As a Packaging Architect, you will own the development of advanced packaging solutions from concept through product release, partnering with cross-functional teams across substrate design, signal integrity, and power integrity. Working directly with product architects, chip designers, and system architects, you will translate complex technical requirements into precise packaging specifications that balance performance, cost, and manufacturability.

You will serve as a key technical decision-maker, driving architecture trade-offs, aligning stakeholders, and ensuring packaging solutions meet both engineering and business objectives across the full product lifecycle.

Responsibilities

• Evaluate and execute trade-offs across EIC/PIC layouts, die-to-die interfaces, fiber attachment methods, and packaging technologies, analyzing impact on performance, power efficiency, cost, manufacturability, and form factor.

• Define and own packaging specifications spanning electrical, thermal, and mechanical performance, ensuring

Department: Photonics Packaging Engineering